Addressable vertical cavity surface emitting laser array for generating structured light patterns

ABSTRACT

An addressable vertical cavity surface emitting laser (VCSEL) array may generate structured light in dot patterns. The VCSEL array includes a plurality of traces that control different groups of VCSELs, such that each group of VCSELs may be individually controlled. The VCSEL groups are arranged such that they emit a dot pattern, and by modulating which groups of VCSELs are active a density of the dot pattern may be adjusted. The VCSEL array may be part of a depth projector that projects the dot pattern into a local area. A projection assembly may replicate the dot pattern in multiple tiles.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of co-pending U.S. application Ser.No. 16/521,480, filed Jul. 24, 2019, which claims the benefit of U.S.Provisional Application No. 62/835,965, filed on Apr. 18, 2019, each ofwhich is incorporated by reference in its entirety.

FIELD OF ART

This disclosure relates generally to generating structured lightpatterns, and more specifically to an addressable vertical cavitysurface emitting laser (VCSEL) array for generating structured lightpatterns.

BACKGROUND

Very generally, structured light sensing is the process of projecting aknown structured light pattern (e.g., bars) onto a scene using astructured light projector. Depth information of the scene may becalculated using images of the scene illuminated with the structuredlight pattern. Effectiveness of the structured light pattern is based inpart on a density of the pattern features. Conventional structured lightprojectors typically have a fixed pattern that is not dynamicallyadjusted. Accordingly, conventional structured light projectorstypically are optimized for a particular range of distances—but outsideof those distances the pattern either becomes too dense (e.g., such thatthe features are not resolvable from each other) or too sparse (e.g.,leads to very low resolution).

SUMMARY

An addressable vertical cavity surface emitting laser (VCSEL) arrayconfigured to generate a plurality of different dot patterns. In someembodiments, the dot patterns are directly projected into a local areato form a structured light pattern. In other embodiments, one or more ofthe dot patterns are tiled throughout the local area to form thestructured light pattern. The VCSEL array includes a plurality ofconductive traces that control different groups of VCSELs, such thateach group of VCSELs may be individually controlled. The VCSEL groupsare configured to emit a respective dot pattern. By modulating whichgroups of VCSELs are active different dot patterns may be emitted. Forexample, one set of one or more VCSEL groups may emit a dot pattern thathas a first dot density, and a different set of one or more VCSEL groupsmay emit a dot pattern of a second dot density that is different thanthe first dot density. The VCSEL array may be formed such that theconductive traces are all in the same plane and do not overlap. In someembodiments, one or more of the conductive traces may be in differentplanes and pass over and/or under one or more other conductive traces.In some embodiments, the VCSELs in different groups may emit light atdifferent wavelengths. The VCSEL array may be part of a depth projectorthat projects the dot pattern into a local area.

In some embodiments, a vertical cavity surface emitting laser (VCSEL)array may comprise: a plurality of groups of VCSELs on a single VCSELchip, where each group of VCSELs forms a different dot pattern; and aplurality of traces, where each trace conductively couples to arespective group of VCSELs such that each group of VCSELs isindividually addressable.

In some embodiments, a structured light projector may comprise: a firstgroup of emitters conductively coupled to a first trace; and a secondgroup of emitters conductively coupled to a second trace, wherein thefirst group of emitters and the second group of emitters areindividually addressable.

In some embodiments, a method may comprise: selecting a first dotpattern, of a plurality of dot patterns, based in part on a targetdensity and a target distance, wherein the first dot pattern isassociated with a subset of traces of a plurality of traces on a chip,and each respective trace is conductively coupled to a respective groupof VCSELs on the chip; activating at least one group of VCSELs that areconductively coupled via the first subset of traces, such that theactivated at least one group of VCSELs emit light that forms a first dotpattern; and projecting the first dot pattern into the local area,wherein the first dot pattern has the target density at the targetdistance.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a perspective view of a headset implemented as an eyeweardevice, in accordance with one or more embodiments.

FIG. 1B is a perspective view of a headset implemented as a head-mounteddisplay, in accordance with one or more embodiments.

FIG. 2 is a block diagram of a depth camera assembly, in accordance withone or more embodiments.

FIG. 3A is a schematic side view of a structured light projector, inaccordance with one or more embodiments.

FIG. 3B is an example of a structured light pattern, in accordance withone or more embodiments.

FIG. 4A is a plan view of a VCSEL chip having sinusoidal traces, inaccordance with one or more embodiments.

FIG. 4B is a plan view of a VCSEL chip having overlapping traces, inaccordance with one or more embodiments.

FIG. 4C is a plan view of a VCSEL chip having angled traces, inaccordance with one or more embodiments.

FIG. 5 is a flowchart illustrating a process for generating a structuredlight pattern, in accordance with one or more embodiments.

FIG. 6 is a system that includes a headset, in accordance with one ormore embodiments.

The figures depict various embodiments for purposes of illustrationonly. One skilled in the art will readily recognize from the followingdiscussion that alternative embodiments of the structures and methodsillustrated herein may be employed without departing from the principlesdescribed herein.

DETAILED DESCRIPTION

A VCSEL array is configured to generate a plurality of different dotpatterns. The VCSEL array may be part of a structured light projector ofa depth camera assembly (e.g., for a headset). The VCSEL array includesa plurality of groups of emitters. Each group of emitters may comprisemultiple discrete VCSELs which each generate a beam of light (e.g.,near-infrared light). Each group of emitters may be independentlycontrolled (e.g., by a depth camera assembly). Controlling a group ofemitters may comprise instructing emitters in the group to emit light,instructing emitters in the group not to emit light, varying anintensity of light emitted from the emitters in the group, varying awavelength of the light emitted by the emitters in the group, varying atemperature of the emitters in the group, or some combination thereof.For example, near field depth sensing (relative to far field) may use arelatively less dense dot pattern, and some emitters may be inactivated.In contrast, far field depth sensing may use a relatively denser dotpattern, and more emitters may be activated.

The addressable groups of emitters allow for a greater variety of dotpatterns to be dynamically generated compared to conventional systems.Any desired dot density may be achieved through trace pattern design andselective activation of groups of emitters. Additionally, power input isproportional to the dot density. Thus, using a single VCSEL array, adepth camera assembly may select a less dense dot pattern for a nearrange application to save power. Subsequently, the depth camera assemblymay adjust the dot density for a far range application by increasing thedot pattern density.

Embodiments of the invention may include or be implemented inconjunction with an artificial reality system. Artificial reality is aform of reality that has been adjusted in some manner beforepresentation to a user, which may include, e.g., a virtual reality (VR),an augmented reality (AR), a mixed reality (MR), a hybrid reality, orsome combination and/or derivatives thereof. Artificial reality contentmay include completely generated content or generated content combinedwith captured (e.g., real-world) content. The artificial reality contentmay include video, audio, haptic feedback, or some combination thereof,any of which may be presented in a single channel or in multiplechannels (such as stereo video that produces a three-dimensional effectto the viewer). Additionally, in some embodiments, artificial realitymay also be associated with applications, products, accessories,services, or some combination thereof, that are used to create contentin an artificial reality and/or are otherwise used in an artificialreality. The artificial reality system that provides the artificialreality content may be implemented on various platforms, including awearable device (e.g., headset) connected to a host computer system, astandalone wearable device (e.g., headset), a mobile device or computingsystem, or any other hardware platform capable of providing artificialreality content to one or more viewers.

FIG. 1A is a perspective view of a headset 100 implemented as an eyeweardevice, in accordance with one or more embodiments. In some embodiments,the eyewear device is a near eye display (NED). In general, the headset100 may be worn on the face of a user such that content (e.g., mediacontent) is presented using a display assembly and/or an audio system.However, the headset 100 may also be used such that media content ispresented to a user in a different manner. Examples of media contentpresented by the headset 100 include one or more images, video, audio,or some combination thereof. The headset 100 includes a frame, and mayinclude, among other components, a display assembly including one ormore display elements 120, a depth camera assembly (DCA), an audiosystem, and a position sensor 190. While FIG. 1A illustrates thecomponents of the headset 100 in example locations on the headset 100,the components may be located elsewhere on the headset 100, on aperipheral device paired with the headset 100, or some combinationthereof. Similarly, there may be more or fewer components on the headset100 than what is shown in FIG. 1A.

The frame 110 holds the other components of the headset 100. The frame110 includes a front part that holds the one or more display elements120 and end pieces (e.g., temples) to attach to a head of the user. Thefront part of the frame 110 bridges the top of a nose of the user. Thelength of the end pieces may be adjustable (e.g., adjustable templelength) to fit different users. The end pieces may also include aportion that curls behind the ear of the user (e.g., temple tip, earpiece).

The one or more display elements 120 provide light to a user wearing theheadset 100. As illustrated the headset includes a display element 120for each eye of a user. In some embodiments, a display element 120generates image light that is provided to an eyebox of the headset 100.The eyebox is a location in space that an eye of user occupies whilewearing the headset 100. For example, a display element 120 may be awaveguide display. A waveguide display includes a light source (e.g., atwo-dimensional source, one or more line sources, one or more pointsources, etc.) and one or more waveguides. Light from the light sourceis in-coupled into the one or more waveguides which outputs the light ina manner such that there is pupil replication in an eyebox of theheadset 100. In-coupling and/or outcoupling of light from the one ormore waveguides may be done using one or more diffraction gratings. Insome embodiments, the waveguide display includes a scanning element(e.g., waveguide, mirror, etc.) that scans light from the light sourceas it is in-coupled into the one or more waveguides. Note that in someembodiments, one or both of the display elements 120 are opaque and donot transmit light from a local area around the headset 100. The localarea is the area surrounding the headset 100. For example, the localarea may be a room that a user wearing the headset 100 is inside, or theuser wearing the headset 100 may be outside and the local area is anoutside area. In this context, the headset 100 generates VR content.Alternatively, in some embodiments, one or both of the display elements120 are at least partially transparent, such that light from the localarea may be combined with light from the one or more display elements toproduce AR and/or MR content.

In some embodiments, a display element 120 does not generate imagelight, and instead is a lens that transmits light from the local area tothe eyebox. For example, one or both of the display elements 120 may bea lens without correction (non-prescription) or a prescription lens(e.g., single vision, bifocal and trifocal, or progressive) to helpcorrect for defects in a user's eyesight. In some embodiments, thedisplay element 120 may be polarized and/or tinted to protect the user'seyes from the sun.

Note that in some embodiments, the display element 120 may include anadditional optics block (not shown). The optics block may include one ormore optical elements (e.g., lens, Fresnel lens, etc.) that direct lightfrom the display element 120 to the eyebox. The optics block may, e.g.,correct for aberrations in some or all of the image content, magnifysome or all of the image, or some combination thereof

The DCA determines depth information for a portion of a local areasurrounding the headset 100. The DCA includes one or more imagingdevices 130, a structured light projector 140, and a DCA controller 150.In some embodiments, the structured light projector 140 illuminates aportion of the local area with light. The light may be, e.g., structuredlight (e.g., dot pattern, bars, etc.) in the infrared (IR), IR flash fortime-of-flight, etc. In some embodiments, the one or more imagingdevices 130 capture images of the portion of the local area that includethe light from the structured light projector 140. As illustrated, FIG.1A shows a single structured light projector 140 and two imaging devices130. In alternate embodiments, there is no structured light projector140 and at least two imaging devices 130.

The structured light projector 140 comprises at least one VCSEL chip. AVCSEL emits a plurality of different dot patterns. The VCSEL chipincludes a plurality of traces. A trace includes a plurality of emittersthat have an arrangement on the VCSEL chip (such as sinusoidalarrangement, a pseudo random arrangement, etc.). The arrangement is suchthat when a trace is active, the plurality of emitters emit a dotpattern that has a spatial distribution that corresponds to thearrangement of the plurality of emitters. In some embodiments, thearrangement may be the same for different traces. Alternatively, thearrangement may be different between at least one trace and one othertrace on the VCSEL chip. In some embodiments, the arrangement isdifferent for each of the traces. Each emitter may emit a beam of lightresulting in a dot. The particular arrangement is such that lightemitted from the plurality of emitters for a trace forms a correspondingdot pattern in the local area. Each trace may be individuallyaddressable. Thus, different dot patterns may be generating byactivating different traces on the VCSEL chip. In circumstances where ahigh-density dot pattern is desirable, such as for depth-sensing at longranges, the DCA controller 150 may activate all traces on the VCSELchip. In circumstances where a low-density dot pattern is desirable,such as for depth sensing at short ranges, the DCA controller 150 mayactivate a subset of the traces on the VCSEL chip. The VCSEL chips andtheir operation are discussed in greater detail with respect to FIG.2-FIG. 5.

The DCA controller 150 computes depth information for the portion of thelocal area using the captured images and one or more depth determinationtechniques. The depth determination technique may be, e.g., directtime-of-flight (ToF) depth sensing, indirect ToF depth sensing,structured light, passive stereo analysis, active stereo analysis (usestexture added to the scene by light from the structured light projector140), some other technique to determine depth of a scene, or somecombination thereof

The audio system provides audio content. The audio system includes atransducer array, a sensor array, and an audio controller. However, inother embodiments, the audio system may include different and/oradditional components. Similarly, in some cases, functionality describedwith reference to the components of the audio system can be distributedamong the components in a different manner than is described here. Forexample, some or all of the functions of the controller may be performedby a remote server.

The transducer array presents sound to user. The transducer arrayincludes a plurality of transducers. A transducer may be a speaker 160or a tissue transducer 170 (e.g., a bone conduction transducer or acartilage conduction transducer).

The sensor array detects sounds within the local area of the headset100. The sensor array includes a plurality of acoustic sensors 180. Anacoustic sensor 180 captures sounds emitted from one or more soundsources in the local area (e.g., a room). Each acoustic sensor isconfigured to detect sound and convert the detected sound into anelectronic format (analog or digital). The acoustic sensors 180 may beacoustic wave sensors, microphones, sound transducers, or similarsensors that are suitable for detecting sounds.

The audio controller (not shown in FIG. 1A) processes information fromthe sensor array that describes sounds detected by the sensor array. Theaudio controller may comprise a processor and a computer-readablestorage medium. The audio controller may be configured to generatedirection of arrival (DOA) estimates, generate acoustic transferfunctions (e.g., array transfer functions and/or head-related transferfunctions), track the location of sound sources, form beams in thedirection of sound sources, classify sound sources, generate soundfilters for the speakers 160, or some combination thereof.

The position sensor 190 generates one or more measurement signals inresponse to motion of the headset 100. The position sensor 190 may belocated on a portion of the frame 110 of the headset 100. The positionsensor 190 may include an inertial measurement unit (IMU). Examples ofposition sensor 190 include: one or more accelerometers, one or moregyroscopes, one or more magnetometers, another suitable type of sensorthat detects motion, a type of sensor used for error correction of theIMU, or some combination thereof. The position sensor 190 may be locatedexternal to the IMU, internal to the IMU, or some combination thereof.

In some embodiments, the headset 100 may provide for simultaneouslocalization and mapping (SLAM) for a position of the headset 100 andupdating of a model of the local area. For example, the headset 100 mayinclude a passive camera assembly (PCA) that generates color image data.The PCA may include one or more RGB cameras that capture images of someor all of the local area. In some embodiments, some or all of theimaging devices 130 of the DCA may also function as the PCA. The imagescaptured by the PCA and the depth information determined by the DCA maybe used to determine parameters of the local area, generate a model ofthe local area, update a model of the local area, or some combinationthereof. Furthermore, the position sensor 190 tracks the position (e.g.,location and pose) of the headset 100 within the room. Additionaldetails regarding the components of the headset 100 are discussed belowin connection with FIG. 6.

FIG. 1B is a perspective view of a headset 105 implemented as a HMD, inaccordance with one or more embodiments. In embodiments that describe anAR system and/or a MR system, portions of a front side of the HMD are atleast partially transparent in the visible band (˜380 nm to 750 nm), andportions of the HMD that are between the front side of the HMD and aneye of the user are at least partially transparent (e.g., a partiallytransparent electronic display). The HMD includes a front rigid body 115and a band 175. The headset 105 includes many of the same componentsdescribed above with reference to FIG. 1A, but modified to integratewith the HMD form factor. For example, the HMD includes a displayassembly, a DCA, an audio system, and a position sensor 190. FIG. 1Bshows the structured light projector 140, a plurality of the speakers160, a plurality of the imaging devices 130, a plurality of acousticsensors 180, and the position sensor 190.

FIG. 2 is a block diagram of a DCA 200 for a headset, in accordance withone or more embodiments. In some embodiments, the DCA 200 may be the DCAdescribed with respect to FIG. 1A and FIG. 1B. Some embodiments of theDCA 200 have different components than those described here. Similarly,the functions can be distributed among the components in a differentmanner than is described here. In some embodiments, some of thefunctions of the DCA 200 may be part of different components (e.g., somemay be part of the headset and some maybe part of a console and/orserver).

The DCA 200 generates depth information of a local area, such as a room.Depth information includes pixel values defining distance from the DCA200, providing a mapping of locations captured in the depth information,such as a three-dimensional mapping of locations captured in the depthinformation. The DCA 200 includes a structured light projector 210, acamera assembly 220, and a controller 230.

The structured light projector 210 generates structured light andprojects the structured light into the local area. The structured lightprojector 140 of FIG. 1A may be an embodiment of the structured lightprojector 210. The structured light projector 210 comprises one or moreillumination sources, an optical assembly, and a projection assembly. Anillumination source is configured to emit light (e.g., as an opticalbeam), and may emit multiple wavelengths of light. The illuminationsource may emit light in, e.g., a visible band (˜380 nm to 750 nm), inan infrared (IR) band (˜750 nm to 1,800 nm), in an ultraviolet band(˜100 nm to 380 nm), some other portion of the electromagnetic spectrumthat the camera assembly 220 is configured to detect, or somecombination thereof. Light emitted from the one or more of theillumination sources may be, e.g., polarized (e.g., linear, circular,etc.).

The illumination source may comprise a vertical-cavity surface-emittinglaser (VCSEL) chip. The VCSEL chip may comprise a plurality of traces.Each trace may comprise a plurality of emitters that have an arrangementon the VCSEL chip (such as sinusoidal arrangement, a pseudo randomarrangement, etc.). In some embodiments, one or more traces on the VCSELchip may overlap. The arrangement is such that when a trace is active,the plurality of emitters emit a dot pattern that has a spatialdistribution that corresponds to the arrangement of the plurality ofemitters. Each emitter may emit a beam of light resulting in a dot. Theemitters may emit light of different wavelengths or polarizations. Eachtrace may be individually addressable. Thus, different dot patterns maybe generating by activating different traces on the VCSEL chip. Incircumstances where a high-density dot pattern is desirable, such as fordepth-sensing at long ranges, the DCA controller 150 may activate alltraces on the VCSEL chip. In circumstances where a low-density dotpattern is desirable, such as for depth sensing at short ranges, the DCAcontroller 150 may activate a subset of the traces on the VCSEL chip.

In some embodiments, the emitter arrangement may be the same fordifferent traces. Alternatively, the arrangement may be differentbetween at least one trace and one other trace on the VCSEL chip. Insome embodiments, the arrangement is different for each of the traces.In this manner, the VCSEL chip can emit dot patterns of variabledensity, where density of the emitted dot pattern increases with anumber of traces that are activated. In some embodiments, each emittermay be controlled by its own trace. Thus, each emitter on the VCSEL chipcould be individually controlled. The VCSEL chips and their operationare discussed in additional detail with respect to FIG. 3-FIG. 5.

The projection assembly projects one or more structured light patternsinto the local area. The conditioned one or more dot patterns form acorresponding structured light pattern that the projection assemblyprojects into the local area. Each trace may emit a particular dotpattern. The combination of active dot patterns combines to form acorresponding structured light pattern in the local area. With differentactive groups of emitters, the projection assembly projects differentstructured light patterns. The projection assembly comprises one or moreoptical elements that direct the structured light pattern into the localarea. For example, the projection assembly could comprise a plurality oflenses. In some embodiments, the projection assembly includes a beamshaping element that changes a profile, or general intensity envelope,of the structured light. The structured light pattern includes aplurality of structured light elements. Each element is a discreteportion of the structured light pattern, such as a dot.

The projection assembly generates a plurality of tiles using theconditioned light (dot pattern emitted by the VCSEL array) and projectsthe tiles throughout the local area to form a structured light pattern.The projection assembly may comprise one or more optical elements, suchas diffractive optical elements (e.g., 1D and/or 2D gratings), scanningmirrors (e.g., MEMS mirror), lenses, mirrors, or some combinationthereof

In some embodiments, all of the tiles generated by the projectionassembly have the same dot pattern. In other embodiments, the projectionassembly may generate one or more tiles that have a dot pattern that isdifferent from at least one other tile. For example, the VCSEL chip maygenerate a first dot pattern that is projected into a particular portionof the local area using a scanning mirror, and then produce a second dotpattern that is projected into a different portion of the local areausing a scanning mirror.

The structured light projector 210 may vary the structured light patternin accordance with illumination instructions from the controller 230. Insome embodiments, the structured light projector 210 may project thesame pattern over the entire field of view of the structured lightprojector 210, or the structured light projector 210 may projectdifferent structured light patterns to different portions of the fieldof view. For example, the structured light pattern may be formed from aplurality of tiles that are each projected into a respective portion ofthe field of view of the structured light projector 210. The pluralityof tiles together form an entire structured light pattern. In someembodiments, each tile of the structured light pattern may contain adifferent structured light pattern and may be individually adjusted. Forexample, in response to a change in condition at a given instant intime, the structured light projector 210 may increase the intensity ofthe structured light pattern in a first tile, such as by activating atrace or by increasing the current driven through a trace, and thestructured light projector 210 may simultaneously decrease the intensityof the structured light pattern in a second tile, such as bydeactivating a trace or decreasing the current driven through the trace.For each portion of the field of view of the structured light projector210, the structured light projector 210 may adjust any suitable propertyof the structured light pattern, such as the intensity, density, patternshape (e.g., dots, grids), polarization, blink rate, etc. In someembodiments, the structured light pattern may be time multiplexed, suchthat different patterns are projected into different portions of thefield of view at different times.

The structured light projector 210 may vary the structured light patternby having different groups of emitters be active and/or having some orall of the emitters be tunable. In some embodiments, the structuredlight pattern is controlled by controlling each emitter individually orby group or section, in which the dynamic properties are manifested inthe projected pattern in terms of pattern shape, intensity,polarization, temporal modulation, field of view, etc. In someembodiments, the combination of using an addressable light source andtunable optics may be adopted to realize dynamic light patterns withconsiderations in projector size, weight, power, cost, etc.

Different VCSEL chips may be designed for specific applications. In someembodiments, the structured light projector 210 may apply differentcurrents or pulse durations to different traces to make a structuredlight pattern with multiple dot intensity levels. This may make the dotconstellation detection algorithm less complicated, which may reduce acomputation power requirement. Additionally, by placing emitters onnarrow curved traces, the layout allows uniform coverage of dot emittersacross a VCSEL chip.

The camera assembly 220 is configured to capture images of the localarea. The camera assembly 220 includes one or more imaging devices(e.g., a camera) that can capture images in at least a band of thestructured light pattern, such as in the infrared band. The imagingdevices 130 of FIG. 1A may be an embodiment of the camera assembly 220.In some embodiments, the one or more imaging devices and/or otherimaging devices of the camera assembly 220 may also capture light in avisible optical band. In some instances, some or all of the capturedimages of the local area may include some or all of the structured lightpattern (e.g., reflected by objects in the local area).

The controller 230 controls the components of the DCA 200. Thecontroller may comprise an illumination module 250 and a depthmeasurement module 240. Some embodiments of the controller 230 havedifferent components than those described here. Similarly, the functionscan be distributed among the components in a different manner than isdescribed here. In some embodiments, some of the functions of thecontroller 230 may be part of different components (e.g., some may bepart of the headset and some maybe part of a console and/or server).

The illumination module 250 may generate illumination instructions toprovide to the structured light projector 210 to project a structuredlight pattern. The illumination instructions may reduce (and in somecases minimize) power consumption of the structured light projector 210while providing sufficient texture in the local area to calculate depthinformation. In some embodiments, the illumination module 250 maydetermine that the local area contains sufficient texture based on aconfidence level of depth measurements (e.g., texture may be sufficientif depth measurements are calculated with a confidence level of greaterthan 95%, or greater than 50%).

In some embodiments, the illumination instructions may cause thestructured light projector to activate or deactivate groups of emittersbased on a distance to an object. For example, in response to a known ormeasured distance to an object that is less than a threshold distance,such as less than 3 feet, or less than 10 feet, the illuminationinstructions may cause the structured light projector 210 to deactivateat least one group of emitters, or a percentage of the groups ofemitters, such as 50% of the groups of emitters. In response to a knownor measured distance to an object that is greater than the thresholddistance, the illumination instructions may instruct the structuredlight projector 210 to activate all of the groups of emitters, or apercentage of the groups of emitters, such as at least 75% of the groupsof emitters. In some embodiments, different numbers or combinations ofthe groups of emitters may be activated based on different distances toobjects.

The depth measurement module 240 determines depth information for eachpixel of an image based on images captured by the camera assembly 220and stores the depth information for each pixel in association with thepixel to generate the depth image. The depth measurement module analyzesthe images containing the structured light pattern. Distortions in thestructured light pattern by three-dimensional objects in the local areaallow the DCA to calculate three-dimensional depth information. In someembodiments, the depth measurement module uses known methods tocalculate depth information, such as active stereo, time-of-flight, etc.

FIG. 3A is an example schematic side view of a structured lightprojector 300 according to one or more embodiments. In some embodiments,the structured light projector 300 may be an embodiment of thestructured light projector 210 of FIG. 2. The structured light projector300 may comprise at least one VCSEL chip 310 and an optical assembly320. The VCSEL chip 310 is an embodiment of the VCSEL array and/or VCSELchip described above. Note, while a single VCSEL chip 310 is shown, inother embodiments, multiple VCSEL chips may part of the structured lightprojector 300. In some embodiments, the structured light projector 300may also include a projection assembly 330. The structured lightprojector 300 generates and projects a structured light pattern, of aplurality of structured light patterns, in accordance with instructionsfrom a depth camera assembly (not shown), such as the depth cameraassembly 200 of FIG. 2.

The structured light projector 300 projects structured light 315 into alocal area 325. The local area 325 may include one or more objects, suchas object 335 and object 345. The object 335 and the object 345 may belocated at different distances to the structured light projector 300.Based on the different distances, the structured light projector 300 mayselect different structure light densities or patterns to illuminate theobject 335 and the object 345. For example, the structured lightprojector 300 may select a denser pattern in the area of object 335, anda relatively less dense pattern in the area of object 345.

The optical assembly 320 conditions light from the VCSEL chip 310 ofFIG. 3A. Conditioning light may include, e.g., collimating light fromthe VCSEL chip 310, error and/or aberration correction, beam expansion,projection, or some combination thereof. The optical assembly 320 maycomprise one or more lenses, mirrors, or other components configured tocondition light from the VCSEL chip 310. In some embodiments, there isno beam multiplication DOE and the optical assembly 320 projects theconditioned light directly into the local area. In this case theconditioned dot pattern is the structured light pattern. In someembodiments the optical assembly may comprise a beam combiner thatcombines beams from different VCSEL chips to further increase patterndensity. For example, different VCSELs may emit light at differentwavelengths, which may be combined using a dichroic mirror.

In some embodiments, the structured light projector 300 may also includea projection assembly 330. The projection assembly 330 generates aplurality of tiles 340 using the conditioned light (dot pattern emittedby the VCSEL array) and projects the tiles throughout the local area toform a structured light pattern. The projection assembly 330 maycomprise one or more optical elements, such as diffractive opticalelements (e.g., 1D and/or 2D gratings), scanning mirrors (e.g., MEMSmirror), lenses, mirrors, or some combination thereof

FIG. 3B is an example of a structured light pattern according to one ormore embodiments. The structured light projector 300 of FIG. 3Agenerates a dot pattern comprising a plurality of dots 350, of aplurality of dot patterns, in accordance with instructions from acontroller of a depth camera assembly (not shown).

In the illustrated example, the projection assembly 330 replicates theconditioned light (dot pattern) to form a n×M tile pattern in the localarea, where each tile comprises the dot pattern, and n and M areintegers. In some embodiments, all of the instances have the same dotpattern (e.g., as illustrated). In other embodiments, the projectionassembly may generate one or more tiles that have a dot pattern that isdifferent from at least one other tile. For example, a row 360 of tilesincluding tiles 340 a, 340 b, and 340 c may receive beams from emitterson a first subset of the traces, a row 370 of tiles may receive beamsfrom emitters on a second subset of the traces, and a row 380 of tilesmay receive beams from emitters on a third subset of the traces. Forexample, the VCSEL chip may generate a first dot pattern that isprojected into a particular portion (e.g., that would be occupied by row360) of the local area using a scanning mirror, and then produce asecond dot pattern that is projected into a different portion (e.g.,that would be occupied by row 370) of the local area using a scanningmirror.

In another example, a density of the dot pattern for each tile may bedependent on instructions from the DCA. For example, the DCA mayinstruct the structured light projector 300 to provide a particulardensity pattern based on how far objects are located away from the DCA.For example, a portion of the local area that is closer to a user (e.g.,user's hands) may have tiles with a dot pattern density that is lowerthan a portion of the local area that is far from the user (e.g., 20feet away).

As mentioned, each trace can be made to have a unique intensity bysetting, for example, different numbers of emitters in each trace. Othermethods can include driving each trace with a different current or adifferent operating pulse width. The result is a tile with a uniquepattern of dot density or dot intensities. In some embodiments, the tilecan then be projected into the local area.

FIG. 4A is a plan view of a VCSEL chip 400 according to one or moreembodiments. The VCSEL chip is an example of the VCSEL array. The VCSELchip 400 may comprise a plurality of bond pads 410, 420, a plurality oftraces 430, and a plurality of emitters 400 deposited on a substrate450. The VCSEL chip 400 may be a component of the structured lightprojector 210 of FIG. 2.

A first series of bond pads 410 and a second series of bond pads 420provide coupling locations between the substrate 450 and the pluralityof traces 430. A voltage differential may be applied between the firstseries of bond pads 410 and the second series of bond pads 420, causingcurrent to flow between electrically connected bond pads. The voltagedifferentials may be selectively applied individually to each pair ofconnected bond pads. Thus, the components connected to each pair ofconnected bond pads may be individually controllable. In someembodiments, each trace 430 may be coupled to the substrate 450 via asingle bond pad in order to reduce the footprint of the substrate.

The plurality of traces 430 provides an electrical connection from abond pad in the first series of bond pads 410 to a bond pad in thesecond series of bond pads 420. The trace 430 may comprise anelectrically conductive material (e.g., copper, gold, etc.) deposited onthe substrate 450. In some embodiments, two or more traces may beconnected in parallel. In some embodiments, a trace 430 may comprise astraight line between two bond pads. In some embodiments, at least aportion of a trace 430 may comprise a change in direction, such as acurve or angle, such that the trace 430 is not a complete straight linebetween the bond pads connected by the trace. The trace 430 may have awidth of approximately 15 microns, or in some embodiments between 5microns-30 microns. As illustrated in FIG. 4A, each trace 430 is in thegeneral shape of a sinusoidal wave. The shape of the traces 430 providefor uniform emitter coverage on the VCSEL chip 400.

In some embodiments, all the traces 430 on the VCSEL chip 400 may becoplanar. The traces 430 may be deposited in a single process, and thetraces 430 may be separated by a separation distance, such as at least 5microns, to prevent electrical communication between adjacent traces.

The plurality of emitters 440 are each VCSELs. Each emitter 440 maygenerate a beam of light which provides one or more dots in a structuredlight pattern. Each trace 430 may comprise a plurality of emitters 440conductively coupled to the trace 430, referred to as a group ofemitters 440. As illustrated, each trace 430 comprises approximately 16emitters 440. However, traces 430 may comprise any suitable number ofemitters 440, such as between 5 and 15 emitters 440, between 1 and 30emitters 440, or greater than 30 emitters 440. The number of emitters440 on a single trace 430 may be limited by a minimum pitch distancebetween emitters 440 which maintains the ability of the emitters 440 toemit a discrete beam of light which is separate from adjacent emitters440. Each emitter 440 may be approximately 5 microns in diameter, orbetween 2 microns-10 microns in diameter. An emitter 440 with a 5 microndiameter may provide a good single mode/gaussian shape dot, with arelatively narrow beam divergence and a suitable dot power consumption.In some embodiments, a minimum pitch distance between emitters 440 ondifferent traces 430 may be approximately 25 microns, or at least 20microns. A minimum pitch distance between emitters 440 on the same trace430 may be approximately 20 microns, or at least 15 microns. In someembodiments the plurality of emitters 440 are all of a same type (e.g.,emit at a same wavelength). In some embodiments, the plurality ofemitters 440 includes at least one emitter 440 that is of a differenttype from another emitter 440 (e.g., emit at two different wavelengths).In some embodiments, all of the emitters 440 in a group are of a sametype. In other embodiments, at least one emitter 440 in a group is of adifferent type than another emitter 440 within the group.

In some embodiments each trace 430 comprises the same number ofoperational emitters, but varies a driving current for each group.Accordingly, some dots from one group may have a higher intensity thandots in a different group. And in some embodiments, intensity ofemitters 440 within a single group may be different from one another.For example, power reduction circuits may be user before one or moreemitters within a group of emitters 440. A power reduction circuitreduces an amount of power provided to a particular emitter 440.

In a further alternative, different traces 430 on the VCSEL chip 400 areof different length, thus having different numbers of emitters 440 inorder to achieve different intensities. In some embodiments, the spacingbetween emitters 440 is even within a group and/or a plurality of groups(in some cases all groups). Alternatively, a spacing between emitters440 on a trace 430 may vary within a group and/or a plurality of groups(in some cases all groups).

In some embodiments, the emitters 440 on a single trace 430 are notcollinear. As shown, the traces 430 are curved, and the multipleemitters 440 are located at different positions along the curved traces430. The emitters 440 on a single trace 430 may be controlled as a groupby controlling the voltage differential between the bond pads 410, 420connected to the trace 430. Thus, each group of emitters 440 may beindividually addressable. By controlling the non-collinear emitters 440as a group, a greater variety of addressable dot patterns may begenerated versus using groups of collinear emitters. In contrast tostraight traces, which may be used for a grid or line pattern, thecurved traces 430 may be used to generate dots in a random pattern, asthe emitters 440 may be placed at any desired locations along the curvedtraces 430. Some applications may benefit from the ability to create astructured light pattern of random or semi-random dots.

FIG. 4B is a plan view of a VCSEL chip 401 with overlapping traces inaccordance with one or more embodiments. The VCSEL chip 401 comprises afirst series of bond pads 411 connected to a second series of bond pads421 by a plurality of traces 431. A plurality of emitters 441 areelectrically coupled to the traces 431. The traces 431 are deposited ona substrate 451. Each trace 431 may be a straight line from a bond pad411 to a bond pad 421. However, in some embodiments one or more of thetraces 431 may have curves or angles.

In some embodiments, at least one trace may overlap at least one othertrace. For example, trace 431A overlaps traces 431B, such that at leasta portion of trace 431B is located between a portion of trace 431A andthe substrate 451. The traces 431A, 431B may be created in differentplanes. To prevent electrical communication between overlapping traces,the traces may be deposited in different layers. For example, a firsttrace 431B may be deposited, a dielectric layer may be deposited overthe first trace 431B, and a second trace 431A may be deposited on thedielectric layer. Thus, the second trace 431A may overlap the firsttrace 431B, and the dielectric layer may prevent electricalcommunication between the first trace and the second trace. In someembodiments, the dielectric layer may be transparent such that lightemitted by the emitters passes through the dielectric layer. In someembodiments, the dielectric layer may be partially opaque, such that aportion of the light emitted by the emitters is obscured by thedielectric layer. Thus, the emitters located under the dielectric layeremitting light at the same intensity as the emitters located over thedielectric layer may generate dots of lesser intensity in the structuredlight pattern. Overlapping traces may provide the ability to generate agreater variety of dot patterns.

FIG. 4C is a plan view of a VCSEL chip 402 with angled traces inaccordance with one or more embodiments. The VCSEL chip 402 comprises afirst series of bond pads 412 connected to a second series of bond pads422 by a plurality of traces 432. A plurality of emitters 442 areelectrically coupled to the traces 432. The traces 432 are deposited ona substrate 452. Each trace 431 may comprise a plurality of straightline segments from a bond pad 411 to a bond pad 421. For example, asshown the trace 432 comprises a first straight segment 462 and a secondstraight segment 472 which intersect at an angle 482. The angle 482 mayrange from greater than 0° to less than 180°. Although shown with twosegments, the traces 432 may comprise any suitable number of straightline segments or curved segments. Angled traces may provide the abilityto generate a greater variety of dot patterns.

Any combination of the above embodiments may also be provided forachieving dots of varying intensity. A reason for combining theembodiments is to provide a residual level of intensity difference withthe further option of increasing the intensity difference when theregion being illuminated demands a greater contrast, a better ambiguity,or a better ability to detect a projected dot pattern.

FIG. 5 is a flowchart of a process 500 for generating a structured lightpattern in accordance with one or more embodiments. The process shown inFIG. 5 may be performed by components of a DCA (e.g., DCA 200). Otherentities may perform some or all of the steps in FIG. 5 in otherembodiments. Embodiments may include different and/or additional steps,or perform the steps in different orders.

The DCA controller selects 510 a first dot pattern, of a plurality ofdot patterns, based in part on a target density and a target distance,wherein the first dot pattern is associated with a subset of traces of aplurality of traces on a chip, and each respective trace is conductivelycoupled to a respective group of VCSELs on the chip. The first dotpattern may be selected based on a distance to an object, based on acalculated texture in a local area, manually input, or selected by anyother suitable process. In some embodiments, the distance may be apreviously known distance. In some embodiments, the distance to theobject may be measured by the depth measurement module.

The DCA controller may initially activate all groups of emitters tocreate a dense dot pattern over the field of view of the cameraassembly. The depth measurement module may measure the distance toobjects within the field of view. Based on the distance, object size,etc., the DCA controller may determine a target density for the firstdot pattern.

The DCA controller activates 520 at least one group of VCSELs that areconductively coupled via the first subset of traces, such that theactivated at least one group of VCSELs emit light that forms a first dotpattern. Activating the groups of VCSELs may cause the emitters coupledto the traces to emit light, or to increase an amount of light emittedby the emitters.

The structured light projector projects 530 the first dot pattern intothe local area, wherein the first dot pattern has the target density atthe target distance. A first portion of the first dot pattern may beprojected by a first group of dot emitters, and a second portion of thefirst dot pattern may be projected by a second group of dot emitters. Insome embodiments, the first portion of the first dot pattern may be afirst tile of the first dot pattern, and the second portion of the firstdot pattern may be a second tile of the first dot pattern. However, insome embodiments, the first portion of the first dot pattern may be afirst plurality of dots in the first dot pattern, and the second portionof the first dot pattern may be a second plurality of dots in the firstdot pattern. The first plurality of dots and the second plurality ofdots may both be projected into a first tile of the first dot pattern.

The DCA controller may select a second dot pattern. The second dotpattern may be less dense than the first pattern density. For example,the DCA controller may determine that a distance to an object hasdecreased, and thus a lesser dot density may be desirable. In someembodiment, the second pattern density may be greater than the firstpattern density. The structured light projector may project the seconddot pattern with the second pattern density.

FIG. 6 is a system 600 that includes a headset 605, in accordance withone or more embodiments. In some embodiments, the headset 605 may be theheadset 100 of FIG. 1A or the headset 105 of FIG. 1B. The system 600 mayoperate in an artificial reality environment (e.g., a virtual realityenvironment, an augmented reality environment, a mixed realityenvironment, or some combination thereof). The system 600 shown by FIG.6 includes the headset 605, an input/output (I/O) interface 610 that iscoupled to a console 615. While FIG. 6 shows an example system 600including one headset 605 and one I/O interface 610, in otherembodiments any number of these components may be included in the system600. For example, there may be multiple headsets each having anassociated I/O interface 610, with each headset and I/O interface 610communicating with the console 615. In alternative configurations,different and/or additional components may be included in the system600. Additionally, functionality described in conjunction with one ormore of the components shown in FIG. 6 may be distributed among thecomponents in a different manner than described in conjunction with FIG.6 in some embodiments. For example, some or all of the functionality ofthe console 615 may be provided by the headset 605.

The headset 605 includes the display assembly 630, an optics block 635,one or more position sensors 640, and the DCA 645. Some embodiments ofheadset 605 have different components than those described inconjunction with FIG. 6. Additionally, the functionality provided byvarious components described in conjunction with FIG. 6 may bedifferently distributed among the components of the headset 605 in otherembodiments, or be captured in separate assemblies remote from theheadset 605.

The display assembly 630 displays content to the user in accordance withdata received from the console 615. The display assembly 630 displaysthe content using one or more display elements (e.g., the displayelements 120). A display element may be, e.g., an electronic display. Inone or more embodiments, the display assembly 630 comprises a singledisplay element or multiple display elements (e.g., a display for eacheye of a user). Examples of an electronic display include: a liquidcrystal display (LCD), an organic light emitting diode (OLED) display,an active-matrix organic light-emitting diode display (AMOLED), awaveguide display, some other display, or some combination thereof. Notein some embodiments, the display element 120 may also include some orall of the functionality of the optics block 635.

The optics block 635 may magnify image light received from theelectronic display, corrects optical errors associated with the imagelight, and presents the corrected image light to one or both eyeboxes ofthe headset 605. In one or more embodiments, the optics block 635includes one or more optical elements. Example optical elements includedin the optics block 635 include: an aperture, a Fresnel lens, a convexlens, a concave lens, a filter, a reflecting surface, or any othersuitable optical element that affects image light. Moreover, the opticsblock 635 may include combinations of different optical elements. Insome embodiments, one or more of the optical elements in the opticsblock 635 may have one or more coatings, such as partially reflective oranti-reflective coatings.

Magnification and focusing of the image light by the optics block 635allows the electronic display to be physically smaller, weigh less, andconsume less power than larger displays. Additionally, magnification mayincrease the field of view of the content presented by the electronicdisplay. For example, the field of view of the displayed content is suchthat the displayed content is presented using almost all (e.g.,approximately 110 degrees diagonal), and in some cases all, of theuser's field of view. Additionally, in some embodiments, the amount ofmagnification may be adjusted by adding or removing optical elements.

In some embodiments, the optics block 635 may be designed to correct oneor more types of optical error. Examples of optical error include barrelor pincushion distortion, longitudinal chromatic aberrations, ortransverse chromatic aberrations. Other types of optical errors mayfurther include spherical aberrations, chromatic aberrations, or errorsdue to the lens field curvature, astigmatisms, or any other type ofoptical error. In some embodiments, content provided to the electronicdisplay for display is pre-distorted, and the optics block 635 correctsthe distortion when it receives image light from the electronic displaygenerated based on the content.

The position sensor 640 is an electronic device that generates dataindicating a position of the headset 605. The position sensor 640generates one or more measurement signals in response to motion of theheadset 605. The position sensor 190 is an embodiment of the positionsensor 640. Examples of a position sensor 640 include: one or more IMUS,one or more accelerometers, one or more gyroscopes, one or moremagnetometers, another suitable type of sensor that detects motion, orsome combination thereof. The position sensor 640 may include multipleaccelerometers to measure translational motion (forward/back, up/down,left/right) and multiple gyroscopes to measure rotational motion (e.g.,pitch, yaw, roll). In some embodiments, an IMU rapidly samples themeasurement signals and calculates the estimated position of the headset605 from the sampled data. For example, the IMU integrates themeasurement signals received from the accelerometers over time toestimate a velocity vector and integrates the velocity vector over timeto determine an estimated position of a reference point on the headset605. The reference point is a point that may be used to describe theposition of the headset 605. While the reference point may generally bedefined as a point in space, however, in practice the reference point isdefined as a point within the headset 605.

The DCA 645 generates depth information for a portion of the local area.The DCA includes one or more imaging devices and a DCA controller. TheDCA 645 may also include a structured light projector. The DCA 200 ofFIG. 2 may be an embodiment of the DCA 645.

The structured light projector comprises at least one VCSEL chip. AVCSEL emits a plurality of different dot patterns. The VCSEL chipincludes a plurality of traces. A trace includes a plurality of emittersthat have an arrangement on the VCSEL chip (such as sinusoidalarrangement, a pseudo random arrangement, etc.). The arrangement is suchthat when a trace is active, the plurality of emitters emit a dotpattern that has a spatial distribution that corresponds to thearrangement of the plurality of emitters. In some embodiments, thearrangement may be the same for different traces. Alternatively, thearrangement may be different between at least one trace and one othertrace on the VCSEL chip. In some embodiments, the arrangement isdifferent for each of the traces. Each emitter may emit a beam of lightresulting in a dot. The particular arrangement is such that lightemitted from the plurality of emitters for a trace forms a correspondingdot pattern in the local area. Each trace may be individuallyaddressable. Thus, different dot patterns may be generating byactivating different traces on the VCSEL chip. In circumstances where ahigh-density dot pattern is desirable, such as for depth-sensing at longranges, the DCA controller 150 may activate all traces on the VCSELchip. In circumstances where a low-density dot pattern is desirable,such as for depth sensing at short ranges, the DCA controller mayactivate a subset of the traces on the VCSEL chip. Operation andstructure of the DCA 645 and the VCSEL chips are discussed in greaterdetail with respect to FIG. 2-FIG. 5.

The audio system 650 provides audio content to a user of the headset605. The audio system 650 may comprise one or acoustic sensors, one ormore transducers, and an audio controller. The audio system 650 mayprovide spatialized audio content to the user. The audio system 650 mayprovide information describing at least a portion of the local area frome.g., the DCA 645 and/or location information for the headset 605 fromthe position sensor 640. The audio system 650 may generate one or moresound filters, and use the sound filters to provide audio content to theuser.

The I/O interface 610 is a device that allows a user to send actionrequests and receive responses from the console 615. An action requestis a request to perform a particular action. For example, an actionrequest may be an instruction to start or end capture of image or videodata, or an instruction to perform a particular action within anapplication. The I/O interface 610 may include one or more inputdevices. Example input devices include: a keyboard, a mouse, a gamecontroller, or any other suitable device for receiving action requestsand communicating the action requests to the console 615. An actionrequest received by the I/O interface 610 is communicated to the console615, which performs an action corresponding to the action request. Insome embodiments, the I/O interface 610 includes an IMU that capturescalibration data indicating an estimated position of the I/O interface610 relative to an initial position of the I/O interface 610. In someembodiments, the I/O interface 610 may provide haptic feedback to theuser in accordance with instructions received from the console 615. Forexample, haptic feedback is provided when an action request is received,or the console 615 communicates instructions to the I/O interface 610causing the I/O interface 610 to generate haptic feedback when theconsole 615 performs an action.

The console 615 provides content to the headset 605 for processing inaccordance with information received from one or more of: the DCA 645,the headset 605, and the I/O interface 610. In the example shown in FIG.6, the console 615 includes an application store 655, a tracking module660, and an engine 665. Some embodiments of the console 615 havedifferent modules or components than those described in conjunction withFIG. 6. Similarly, the functions further described below may bedistributed among components of the console 615 in a different mannerthan described in conjunction with FIG. 6. In some embodiments, thefunctionality discussed herein with respect to the console 615 may beimplemented in the headset 605, or a remote system.

The application store 655 stores one or more applications for executionby the console 615. An application is a group of instructions, that whenexecuted by a processor, generates content for presentation to the user.Content generated by an application may be in response to inputsreceived from the user via movement of the headset 605 or the I/Ointerface 610. Examples of applications include: gaming applications,conferencing applications, video playback applications, or othersuitable applications.

The tracking module 660 tracks movements of the headset 605 or of theI/O interface 610 using information from the DCA 645, the one or moreposition sensors 640, or some combination thereof. For example, thetracking module 660 determines a position of a reference point of theheadset 605 in a mapping of a local area based on information from theheadset 605. The tracking module 660 may also determine positions of anobject or virtual object. Additionally, in some embodiments, thetracking module 660 may use portions of data indicating a position ofthe headset 605 from the position sensor 640 as well as representationsof the local area from the DCA 645 to predict a future location of theheadset 605. The tracking module 660 provides the estimated or predictedfuture position of the headset 605 or the I/O interface 610 to theengine 665.

The engine 665 executes applications and receives position information,acceleration information, velocity information, predicted futurepositions, or some combination thereof, of the headset 605 from thetracking module 660. Based on the received information, the engine 665determines content to provide to the headset 605 for presentation to theuser. For example, if the received information indicates that the userhas looked to the left, the engine 665 generates content for the headset605 that mirrors the user's movement in a virtual local area or in alocal area augmenting the local area with additional content.Additionally, the engine 665 performs an action within an applicationexecuting on the console 615 in response to an action request receivedfrom the I/O interface 610 and provides feedback to the user that theaction was performed. The provided feedback may be visual or audiblefeedback via the headset 605 or haptic feedback via the I/O interface610.

Additional Configuration Information

The foregoing description of the embodiments has been presented forillustration; it is not intended to be exhaustive or to limit the patentrights to the precise forms disclosed. Persons skilled in the relevantart can appreciate that many modifications and variations are possibleconsidering the above disclosure.

Some portions of this description describe the embodiments in terms ofalgorithms and symbolic representations of operations on information.These algorithmic descriptions and representations are commonly used bythose skilled in the data processing arts to convey the substance oftheir work effectively to others skilled in the art. These operations,while described functionally, computationally, or logically, areunderstood to be implemented by computer programs or equivalentelectrical circuits, microcode, or the like. Furthermore, it has alsoproven convenient at times, to refer to these arrangements of operationsas modules, without loss of generality. The described operations andtheir associated modules may be embodied in software, firmware,hardware, or any combinations thereof.

Any of the steps, operations, or processes described herein may beperformed or implemented with one or more hardware or software modules,alone or in combination with other devices. In one embodiment, asoftware module is implemented with a computer program productcomprising a computer-readable medium containing computer program code,which can be executed by a computer processor for performing any or allthe steps, operations, or processes described.

Embodiments may also relate to an apparatus for performing theoperations herein. This apparatus may be specially constructed for therequired purposes, and/or it may comprise a general-purpose computingdevice selectively activated or reconfigured by a computer programstored in the computer. Such a computer program may be stored in anon-transitory, tangible computer readable storage medium, or any typeof media suitable for storing electronic instructions, which may becoupled to a computer system bus. Furthermore, any computing systemsreferred to in the specification may include a single processor or maybe architectures employing multiple processor designs for increasedcomputing capability.

Embodiments may also relate to a product that is produced by a computingprocess described herein. Such a product may comprise informationresulting from a computing process, where the information is stored on anon-transitory, tangible computer readable storage medium and mayinclude any embodiment of a computer program product or other datacombination described herein.

Finally, the language used in the specification has been principallyselected for readability and instructional purposes, and it may not havebeen selected to delineate or circumscribe the patent rights. It istherefore intended that the scope of the patent rights be limited not bythis detailed description, but rather by any claims that issue on anapplication based hereon. Accordingly, the disclosure of the embodimentsis intended to be illustrative, but not limiting, of the scope of thepatent rights, which is set forth in the following claims.

What is claimed is:
 1. A vertical cavity surface emitting laser (VCSEL)array comprising: a plurality of groups of VCSELs on a single VCSELchip, where each group of VCSELs forms a dot pattern; and a plurality oftraces, where each trace conductively couples to a respective group ofVCSELs such that each group of VCSELs is individually addressable,wherein a first trace in the plurality of traces comprises a firststraight segment and a second straight segment, wherein the firststraight segment and the second straight segment join together at anangle greater than 0 degrees and less than 180 degrees.
 2. The VCSELarray of claim 1, wherein each of the plurality of traces comprises afirst straight segment and a second straight segment, wherein the firststraight segment and the second straight segment of each of therespective plurality of traces join together at an angle greater than 0degrees and less than 180 degrees.
 3. The VCSEL array of claim 1,wherein a group of VCSELs, of the plurality of groups of VCSELs, isindividually addressable by changing a voltage differential between afirst bond pad and a second bond pad coupled to a trace thatelectrically connects the group of VCSELs to the first bond pad and thesecond bond pad.
 4. The VCSEL array of claim 1, further comprising aprojection assembly configured to project light emitted by the pluralityof groups of VCSELs into a plurality of tiles.
 5. The VCSEL array ofclaim 1, further comprising a dielectric layer deposited between a firstplane comprising the first trace in the plurality of traces and a secondplane comprising a second trace in the plurality of traces.
 6. The VCSELarray of claim 1, wherein the first trace in the plurality of tracesoverlaps a second trace in the plurality of traces.
 7. The VCSEL arrayof claim 1, wherein a second trace in the plurality of traces comprisesa sinusoidal shape.
 8. A structured light projector comprising: a firstgroup of emitters conductively coupled to a first trace, wherein thefirst trace comprises a first straight segment and a second straightsegment, wherein the first straight segment and the second straightsegment join together at an angle greater than 0 degrees and less than180 degrees; and a second group of emitters conductively coupled to asecond trace, wherein the first group of emitters and the second groupof emitters are individually addressable.
 9. The structured lightprojector of claim 8, further comprising: a first bond pad and a secondbond pad coupled to the first trace, wherein the first group of emittersis individually addressable by changing a voltage differential betweenthe first bond pad and the second bond pad; and a third bond pad and afourth bond pad coupled to the second trace, wherein the second group ofemitters is individually addressable by changing a voltage differentialbetween the third bond pad and the fourth bond pad.
 10. The structuredlight projector of claim 8, further comprising a projection assemblyconfigured to project light emitted by the emitters into a plurality oftiles.
 11. The structured light projector of claim 10, wherein theprojection assembly projects light from the first group of emitters intoa first tile, and wherein the projection assembly projects light fromthe second group of emitters into a second tile.
 12. The structuredlight projector of claim 9, wherein the projection assembly projectslight from the first group of emitters and the second group of emittersinto a first tile.
 13. The structured light projector of claim 8,wherein the second trace comprises a first straight segment and a secondstraight segment, wherein the first straight segment and the secondstraight segment join together at an angle greater than 0 degrees andless than 180 degrees.
 14. The structured light projector of claim 8,further comprising a dielectric layer between a first plane comprisingthe first trace and a second plane comprising the second trace.
 15. Thestructured light projector of claim 14, wherein the second traceoverlaps the first trace.
 16. A method comprising: selecting a first dotpattern, of a plurality of dot patterns, based in part on a targetdensity and a target distance, wherein the first dot pattern isassociated with a first subset of traces of a plurality of traces on achip, wherein each of the first subset of traces comprises a firststraight segment and a second straight segment, wherein the firststraight segment and the second straight segment join together at anangle greater than 0 degrees and less than 180 degrees, and wherein eachrespective trace is conductively coupled to a respective group of VCSELson the chip; activating at least one group of VCSELs that areconductively coupled via the first subset of traces, such that theactivated at least one group of VCSELs emit light that forms a first dotpattern; and projecting the first dot pattern into the local area,wherein the first dot pattern has the target density at the targetdistance.
 17. The method of claim 16, wherein the first subset of tracesincludes at least a first trace and a second trace, and the first traceis conductively coupled to a first group of VCSELs and the second traceis conductively coupled to a second group of VCSELs.
 18. The method ofclaim 16, wherein at least one trace of the plurality of traces isconductively coupled to a group of emitters that is inactive.
 19. Themethod of claim 16, further comprising: capturing images of the localarea including the first dot pattern; determining depth informationassociated with an object within the local area using the capturedimages; dynamically selecting a dot pattern, of the plurality of dotpatterns, based in part on the depth information, wherein the dotpattern is associated with a second subset of traces of the plurality oftraces; activating one or more groups of VCSELs that are conductivelycoupled by the second subset of traces, such that the activated one ormore groups of VCSELs emit light that forms a second dot pattern; andprojecting the second dot pattern into the local area, wherein thesecond dot pattern has a different target density than the first dotpattern.
 20. The method of claim 16, wherein the at least one group ofVCSELs includes a first VCSEL and a second VCSEL and the first VCSEL andthe second VCSEL emit light at different intensities.